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MC33275 Low Dropout 300 mA Voltage Regulator
The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, DPAK, SOT-223, and SOP-8 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33275 is available as a MC33375 which includes an On/Off control. Due to the low input-to-output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable.
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LOW DROPOUT MICROPOWER VOLTAGE REGULATOR
Gnd
4 4
* Low Quiescent Current (125 mA) * Low Input-to-Output Voltage Differential of 25 mV at IO = 10 mA, * Extremely Tight Line and Load Regulation * Stable with Output Capacitance of only 0.33 mF for 2.5 V Output * Internal Current and Thermal Limiting
Simplified Block Diagram
Vin Vout
Features:
1 3 1
MC33275
2 3
and 260 mV at IO = 300 mA
Vin Gnd Vout PLASTIC DT SUFFIX CASE 369A
Voltage
Gnd
4
4 1 3 1
MC33375
2 3
Vin Thermal & Anti-sat Protection Rint
1
Gnd
Vout
PLASTIC ST SUFFIX CASE 318E
8
1.23 V V. Ref. 54 K Gnd This device contains 41 active transistors
8 1
Input
2 7
Output Gnd
3
Gnd Gnd Gnd
4
MC33375
6
Gnd
5
N/C
Pins 4 and 5 Not Connected PLASTIC D SUFFIX CASE 751
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 4
Publication Order Number: MC33275/D
MC33275
MAXIMUM RATINGS (TA = 25C, for min/max values TJ = -40C to +125C)
Rating Input Voltage Power Dissipation and Thermal Characteristics TA = 25C Maximum Power Dissipation Case 751 (SOP-8) D Suffix Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 369A (DPAK) DT Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Case 318E (SOT-223) ST Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Output Current Maximum Junction Temperature Operating Junction Temperature Range Storage Temperature Range Symbol VCC Value 13 Unit Vdc
PD RJA RJC RJA RJC RJA RJC IO TJ TJ Tstg
Internally Limited 160 25 92 6.0 245 15 300 150 - 40 to +125 - 65 to +150
W C/W C/W C/W C/W C/W C/W mA C C C
ELECTRICAL CHARACTERISTICS (CL = 1.0F, TA = 25C, for min/max values TJ = -40C to +125C, Note 1)
Characteristic Output Voltage 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Line Regulation Load Regulation Dropout Voltage IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA Ripple Rejection (120 Hz) Output Noise Voltage CL = 1 mF CL = 200 mF IO = 0 mA to 250 mA TA = 25C, Vin = [VO + 1] V Symbol VO 2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 Regline Regload Vin - VO TJ = -40C to +125C -- -- -- -- -- Vn IO = 50 mA (10 Hz to 100 kHz) -- -- 160 46 -- -- 65 25 115 220 260 75 100 200 400 500 -- dB - - 2.50 3.00 3.30 5.00 -- -- -- -- 2.0 5.0 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 10 25 mV mV mV Min Typ Max Unit Vdc
Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = -40 to +125C
Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25C Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25C
Vin(peak-peak) = [VO + 1.5] V to [VO + 5.5] V
mVrm
s
CURRENT PARAMETERS
Characteristic Quiescent Current On Mode On Mode SAT Current Limit Vin = [VO + 1] V, IO = 0 mA Vin = [VO - 0.5] V, IO = 0 mA, Note 2 Vin = [VO + 1], VO shorted ILIMIT Symbol IQ -- -- -- 125 1100 450 200 1500 -- mA Min Typ Max Unit
mA
THERMAL SHUTDOWN
Characteristic Thermal Shutdown Symbol -- Min -- Typ 150 Max -- Unit C
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO - 0.5] V guarantees this condition.
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MC33275
DEFINITIONS Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following:
qJA The maximum operating junction temperature TJ is specified at 150C, if TA = 25C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as:
I out Pd J + TR - TA
+V
P D - Vout CC
The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150C for MC33275) and ambient temperature.
R
+ TJP- TA qJA
D
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MC33275
Figure 1. Line Transient Response
7 6 Vin , INPUT VOLTAGE (V) 5 4 50 3 2 1 0 0 20 40 60 80 100 120 140 160 180 200 TIME (mS) 0 Vout -50 TA = 25 C CL = 0.47 mF IL = 10 mA Vout = 3.3 V Vin 200 OUTPUT VOLTAGE CHANGE (mV) 150 100 7 TA = 25 C 6 CL = 33 mF IL = 10 mA 5 Vout = 3.3 V 4 3 2 1 0 0 50 100 TIME (mS) 150 200 Vout Vin
Figure 2. Line Transient Response
70 OUTPUT VOLTAGE CHANGE (mV) 60 50 40 30 20 10 0
Vin , INPUT VOLTAGE (V)
-10 -20
-100
Figure 3. Load Transient Response
300 200 100 LOAD CURRENT (mA) 0 -100 -200 -300 -400 CL = 1.0 mF Vout = 3.3 V -500 TA = 25 C -600 Vin = 4.3 V -700 0 50 100 Vout CHANGE LOAD CURRENT 1.0 0.8 OUTPUT VOLTAGE CHANGE (V) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 150 200 250 300 350 -1.0 400 LOAD CURRENT (mA)
350 250 150 50 -50 -150 -250 -350 -450 -550 -650 -750 0
Figure 4. Load Transient Response
0.14
OUTPUT VOLTAGE CHANGE (V)
LOAD CURRENT
0.09 0.04 -0.01
Vout CHANGE
CL = 33.0 mF Vout = 3.3 V TA = 25 C Vin = 4.3 V
-0.06 -0.11 -0.16
50
100
150
200
250
300
TIME (mS)
TIME (mS)
Figure 5. Output Voltage versus Input Voltage
3.5 3.0 2.5 IL = 250 mA 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) DROPOUT VOLTAGE (mV) OUTPUT VOLTAGE (V) IL = 1 mA
Figure 6. Dropout Voltage versus Output Current
300 250 200 150 100 50 0 1 10 100 1000 IO, OUTPUT CURRENT (mA)
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MC33275
Figure 7. Dropout Voltage versus Temperature
300 250 200 Ignd (mA) 150 100 50 0 -40 IL = 250 mA IL = 100 mA 12 10 8 6 4 IL = 100 mA IL = 10 mA 0 25 TEMPERATURE (C) 85 2 IL = 50 mA 0 0 1 2 3 4 Vin (VOLTS) 5 6 7 8 IL = 300 mA
Figure 8. Ground Pin Current versus Input Voltage
DROPOUT VOLTAGE (mV)
IL = 300 mA
Figure 9. Ground Pin Current versus Ambient Temperature
8 7 6 Ignd (mA) 5 4 3 2 1 0 -40 -20 0 20 40 60 80 IL = 50 mA 100 120 140 2.475 2.47 -40 IL = 100 mA Vout (VOLTS) 2.49 2.485 2.48 IL = 250 mA 2.5 2.495
Figure 10. Output Voltage versus Ambient Temperature (Vin = Vout1 +1V)
IO = 0
IO = 250 mA
0
25 TEMPERATURE (C)
85
TA (C)
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MC33275
Figure 11. Output Voltage versus Ambient Temperature (Vin = 12 V)
2.5 2.495 2.49 Vout (VOLTS) 2.485 2.48 2.475 2.47 2.465 -40 0 25 85 IO = 250 mA IO = 0
TEMPERATURE (C)
Figure 12. Ripple Rejection
70 60 IL = 10 mA 50 IL = 1 mA dB dB 40 30 20 10 0 0.1 1 FREQUENCY (kHz) 10 100 40 30 20 10 0 0.1 50 70 60
Figure 13. Ripple Rejection
IL = 100 mA IL = 250 mA
1 FREQUENCY (kHz)
10
100
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MC33275
APPLICATIONS INFORMATION
Figure 14. Typical Application Circuit
Vin MC33275-XX Cin Cout LOAD Vout
GND
EXTERNAL CAPACITORS
These regulators require only a 0.33 mF (or greater) capacitance between the output and ground for stability for 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 mF for stability. The output capacitor must be mounted as close as possible to the MC33275. If the output capacitor must be mounted further than two centimeters away from the MC33275, then a larger value of output capacitor may be required for stability. A value of 0.68 mF or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit's sensitivity to the input line impedance at high frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. Figure 15 shows the ESR that allows the LDO to remain stable for various load currents.
ESR (ohm)
The MC33275 regulators are designed with internal current limiting and thermal shutdown making them user-friendly. Figure 14 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting.
Figure 15. ESR for Vout = 3.0V
100 Vout = 3.0 V Cout = 1.0 mF Cin = 1.0 mF 10 Stable Region 1.0
0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA)
Applications should be tested over all operating conditions to insure stability. THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold.
Thermal limit is not a substitute for proper heatsinking.
The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC33275.
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MC33275
Figure 16. SOT-223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
Free Air Mounted Vertically PD(max) for TA = 50C 2.0 oz. Copper L 1.25 0.83 0.63 0.50 0.42 0.35 0 5.0 10 15 20 25 30 L, LENGTH OF COPPER (mm) PD, MAXIMUM POWER DISSIPATION (W) PD, MAXIMUM POWER DISSIPATION (W) 280 R JA, THERMAL RESISTANCE JUNCTION-TO-AIR (C/W) 240 200 160 120 80 40 Minimum Size Pad 2.50
RJA
R JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (C/W)
Figure 17. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
2.4 Free Air Mounted Vertically PD(max) for TA = 50C 2.0 2.0 oz. Copper L 1.6 1.2 0.8 0.4 0 0 5.0 10 15 20 25 30 L, LENGTH OF COPPER (mm)
100 90 80 70 60 50 40 Minimum Size Pad
RJA
R JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (C/W)
Figure 18. SOP-8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
3.2 PD(max) for TA = 50C 2.8 2.4 Graph Represents Symmetrical Layout 2.0 L RJA 50 30 0 10 20
170 150 130
90 70
L, LENGTH OF COPPER (mm)
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IIIIIII IIIIIII IIIIIII
110
2.0 oz. Copper L
30
IIII IIII IIII
L
IIII IIII IIII
L 3.0 mm 40
1.6 1.2 0.8 0.4
50
MC33275
ORDERING INFORMATION
Operating Temperature Range, Tolerance
Device MC33275DT-2.5RK MC33275ST-2.5T3 MC33275D-2.5R2 MC33275DT-3.0RK MC33275ST-3.0T3 MC33275D-3.0R2 MC33275DT-3.3RK MC33275ST-3.3T3 MC33275D-3.3R2 MC33275DT-5.0RK MC33275ST-5.0T3 MC33275D-5.0R2
Type 2.5 25V (Fixed Voltage)
Case 369A 318E 751-5 369A
Package DPAK SOT-223 SOP-8 DPAK SOT-223 SOP-8 DPAK SOT-223 SOP-8 DPAK SOT-223 SOP-8
3.0 30V (Fixed Voltage)
1% T l Tolerance 25C at TA = 25 C
318E 751-5 369A
3.3 33V (Fixed Voltage)
2% T l Tolerance at t 40 +125 C TJ from -40 to +125C
318E 751-5 369A
5.0 50V (Fixed Voltage) ( g)
318E 751-5
DEVICE MARKING
Device MC33275 MC33275 MC33275 MC33275 Version 2.5V 3.0V 3.3V 5.0V Marking (1st line) 27525 27530 27533 27550
TAPE AND REEL SPECIFICATIONS
Device MC33275DT MC33275D MC33275S Reel Size 13" 13" 13" Tape Width 16mm embossed tape 12mm embossed tape 8mm embossed tape Quantity 2500 units 2500 units 4000 units
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MC33275
PACKAGE DIMENSIONS
A F
ST SUFFIX PLASTIC PACKAGE CASE 318E-04 (SOT-223) ISSUE J
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
4
S
1 2 3
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
D SUFFIX PLASTIC PACKAGE CASE 751-06 (SOP-8) ISSUE T
A
8
D
5
C
E
1 4
H
0.25
M
B
M
h B C e A
SEATING PLANE
X 45 _
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_
q
L 0.10 A1 B 0.25
M
CB
S
A
S
q
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MC33275
PACKAGE DIMENSIONS
DT SUFFIX PLASTIC PACKAGE CASE 369A-13 (DPAK) ISSUE Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 ---
-T- B V R
4
SEATING PLANE
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005) T
DIM A B C D E F G H J K L R S U V Z
M
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MC33275
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MC33275/D

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